Features
Moisture curing. Very good adhesion on porous and nonporous surfaces including EPDM. Resistance to wheather conditions. Fast curing.High elasticity. It does not lose its properties at high and low temperatures (-60 C, +180C ) Does not contain solvent, it has a low modulus. Quickly curing , does not emit odors when curing. Does not cause corrosion and not react with construction materials.
Application Areas
TECHNICAL FEATURES
Basis : Silicone Polymer(Oxime)
Curing System : Neutral/Moisture Cure
Density : 1.20± 0.03 g/ml (ASTM D 792)
Hardness Shore A : 25±5
Tensile Strength : 0,4 N/mm2 (23°C and 50% R.H) (ISO 8339)
Skin formation : 5-10 min. (23°C and 50% R.H)
Curing Rate : Min. 2,5 mm/day (23°C and 50% R.H)
Elongation At Break : 350% 700%
Elastic Recovery : Approx. 100% (ISO 7389)
Sagging : 0 mm (ISO 7390)
Yield : Approx. 12 meters (600 mL) for 0.64 cm bead size
Temperature Resistance : -60°C to +180°C
Application Temperature : +5°C to +40°C
Stock Code | Type | Volume (ml) | Box |
---|---|---|---|
EPMD | Black | 600ml | 20 |